VergebenVergabebekanntmachungLieferauftrag🇪🇺 EU-FörderungTED 105/2026
Silicon Austria Labs – Chips JU: Wafer bumper
Auftraggeber
Veröffentlichung (ABl.)
08.05.2026
Vergabedatum
08.05.2026
Geschätzter Auftragswert
1,3 Mio. €
Vertragslaufzeit
10.0 Monate
Verfahrensart
Verhandlungsverfahren mit Bekanntmachung
Eingegangene Angebote
1 eingegangene Angebote
Sitz des Auftraggebers
Graz (8010) — AT221
Sektor
Beschreibung
The aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of an automated wafer soldering bumping tool as well as services such as trainings for Silicon Austria Labs GmbH.
CPV-Codes
38000000
Lose (1)
LOT-6531Silicon Austria Labs – Chips JU: Wafer bumper
1,3 Mio. €The aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of an automated wafer soldering bumping tool as well as services such as trainings for Silicon Austria Labs GmbH.
3800000010 Monate
Zuschlagskriterien
Commitment to target requirements